发明名称 |
REMOVING PARTICULATE CONTAMINANTS FROM THE BACKSIDE OF A WAFER OR RETICLE |
摘要 |
The invention is directed to a method for removing particulate contaminants from the backside of a wafer or reticle, and to a cleaning substrate for use in such method. In the method of the invention particulate contaminants are removed from the backside of a wafer or reticle with a cleaning substrate. The cleaning substrate comprises protrusions and a tacky layer between the protrusions. The method comprises contacting the backside of the wafer or reticle with the protrusions of the cleaning substrate while maintaining a distance between the wafer or reticle and the tacky layer, the distance being in the range of 1-10 µm. |
申请公布号 |
EP3149763(A1) |
申请公布日期 |
2017.04.05 |
申请号 |
EP20150731412 |
申请日期 |
2015.05.29 |
申请人 |
Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO |
发明人 |
OOSTROM, Sjoerd;VAN DER DONCK, Jacques Cor Johan;KIEVIT, Olaf;PAPEN-BOTTERHUIS, Nicole Ellen |
分类号 |
H01L21/02;B08B7/00;G03F1/82 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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