Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.
申请公布号
EP3151342(A2)
申请公布日期
2017.04.05
申请号
EP20160183823
申请日期
2016.08.11
申请人
Apple Inc.
发明人
TALALAYEV, Anton;NARAJOWSKI, David H.;LIGTENBERG, Christiaan A.;AMINI, Mahmoud R.;LEGGETT, William F.;SILVANTO, Mikael M.;STRINGER, Christopher J.;TZIVISKOS, George;COOPER, Edward J.