| 摘要 |
There is provided a wiring board and a method for manufacturing the wiring board which can prevent an electrical adverse influence attributable to an end surface of a wiring conductor for plating exposed on a side surface of the wiring board, and can also reliably prevent an adverse influence attributable to EMI noise between the inside and the outside of the board main body. A wiring board 1a including a board main body 2 made of an insulating material and having a front surface 3 and rear surface 4 having a rectangular shape in a planar view and side surfaces 5a, 5b at four sides located between the front surface and the rear surface, and a wiring conductor 8 for plating, an end surface of which is exposed on any side surface 5a or 5b of the board main body 2, wherein the wiring board includes a first insulating layer 11 formed on the side surface 5a, 5b on which the end surface of the wiring conductor 8 for plating is exposed among the side surfaces 5a, 5b of the board main body 2 to cover the end surface of the wiring conductor 8 for plating, and a conductor layer 12 formed on the side surface 5a, 5b of the board main body 2 on which the first insulating layer 11 is formed along a side direction of the side surface 5a, 5b including a surface of the first insulating layer 11, and wherein the conductor layer 12 is electrically connected to a ground layer 10 formed inside the board main body 2. |
