发明名称 |
Molding resin composition including chlorinated vinyl chloride-based resin, and molded article thereof |
摘要 |
The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less. The thermal stabilizer contains at least one of a compound represented by the formula Ca1-xMgx(OH)2 where x satisfies the inequality 0<x<1 and a compound represented by the formula Ca1-yMgyO where y satisfies the inequality 0<y<1. |
申请公布号 |
US9611374(B2) |
申请公布日期 |
2017.04.04 |
申请号 |
US201414913053 |
申请日期 |
2014.09.26 |
申请人 |
SEKISUI CHEMICAL CO., LTD.;TOKUYAMA SEKISUI CO., LTD. |
发明人 |
Matsumura Kenichi;Seiki Atsushi;Yamasugi Ryota |
分类号 |
C08L27/24;C08K3/22;C08K5/103;C08K5/098;C08K3/26;C08K5/053 |
主分类号 |
C08L27/24 |
代理机构 |
Wenderoth, Lind & Ponack, L.L.P. |
代理人 |
Wenderoth, Lind & Ponack, L.L.P. |
主权项 |
1. A resin composition for molding, comprising:
a chlorinated vinyl chloride-based resin; a thermal stabilizer; and a polyalcohol and/or a partial ester of a polyalcohol, the chlorinated vinyl chloride-based resin having a chlorine content of 65% by weight or more and less than 72% by weight, the chlorinated vinyl chloride-based resin having, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less, the thermal stabilizer containing at least one compound selected from the group consisting of a compound represented by the formula Ca1-xMgx(OH)2 where x satisfies the inequality 0<x<1 and a compound represented by the formula Ca1-yMgyO where y satisfies the inequality 0<y<1, and the resin composition being free of β-diketone. |
地址 |
Osaka JP |