Interconnect structures with polymer core

摘要

Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.

主权项

1. An apparatus comprising:
a substrate having pads formed on a surface of the substrate; and a plurality of interconnect structures electrically coupled with the pads, wherein individual interconnect structures of the plurality of interconnect structures have
a polymer core,an electrically conductive material disposed on the polymer core, anda solder ball directly coupled with the electrically conductive material disposed on the polymer core; a molding compound disposed on the surface of the substrate, wherein the individual interconnect structures are configured to provide an electrical pathway through the molding compound; and a package-on-package (PoP) disposed on the molding compound and electrically coupled with the pads of the substrate through the electrically conductive material of the individual interconnect structures, wherein a solder ball of an individual interconnect structure is directly adjacent to the PoP, and an electrically conductive material disposed on the polymer core of an individual interconnect structure is directly adjacent to a pad of the pads formed on the surface of the substrate.