发明名称 Wire suspension mounting approach for reduced optical image stabilization package size
摘要 Some embodiments include an optics assembly. In some embodiments, the optics assembly includes an optics component. In some embodiments, the optics assembly is configured to move within the apparatus on one or more axes orthogonal to an optical axis of the optics component. In some embodiments, the optics assembly is suspended by a plurality of wires on a base component of the apparatus, each wire of the plurality of wires being substantially parallel to the optical axis of the optics component. Some embodiments include a base assembly component or substrate having an upper surface plane and a lower surface plane. In some embodiments, one or more terminations are disposed around the plurality of wires. In some embodiments, the terminations are located beyond the upper surface plane of the base assembly component.
申请公布号 US9615025(B2) 申请公布日期 2017.04.04
申请号 US201414478930 申请日期 2014.09.05
申请人 Apple Inc. 发明人 Gleason Jeffrey N.;Dunn Ryan J.;Miller Scott W.
分类号 H04N5/232;G02B7/08;H04N5/225;G02B27/64 主分类号 H04N5/232
代理机构 Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C. 代理人 Kowert Robert C.;Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
主权项 1. An apparatus, comprising: an optics assembly comprising an optics component, wherein the optics assembly is configured to move within the apparatus on one or more axes orthogonal to an optical axis of the optics component,the optics assembly is suspended by a plurality of wires on a base component of the apparatus, each wire of the plurality of wires being substantially parallel to the optical axis of the optics component; a base assembly component having an upper surface plane and a lower surface plane, wherein the base assembly component is a substrate supporting an image sensor for capturing an image data structure representing light received through the optics component; and one or more terminations disposed around the plurality of wires, wherein the terminations are configured to terminate respective ones of the plurality of wires, andthe terminations are located beyond the upper surface plane of the base assembly component, when measured from the optics assembly.
地址 Cupertino CA US