Semiconductor memory capable of performing through-chip via test and system using the same

摘要

A semiconductor memory may include a plurality of stacked semiconductor chips which are interconnected using through-chip vias. The semiconductor memory may set chip IDs of the respective semiconductor chips by using a chip code such that the chip IDs are different from each other, and perform a through-chip via test for the plurality of stacked semiconductor chips by changing the chip IDs of the respective semiconductor chips during a test mode period.

主权项

1. A semiconductor memory comprising a plurality of semiconductor chips which are interconnected using through-chip vias,
wherein the semiconductor memory sets chip IDs of the plurality of semiconductor chips by changing a chip code such that the chip IDs are different from each other, and performs a through-chip via test for the plurality of semiconductor chips by activating a current source of a desired chip of the plurality of semiconductor chips to flow a current from the current source through the through-chip vias, wherein the activating the current source of the desired chip is operated by changing the chip IDs of the plurality of semiconductor chips again during a test mode period.