Lead-free solder alloy for vehicle glass

摘要

A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass % of Cu and 0.001 to 0.01 mass % of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance.

主权项

1. A lead-free solder alloy for a vehicle glass, comprising:
26.0 to 56.0 mass % of In; 0.1 to 5.0 mass % of Ag; 0.005 to 0.1 mass % of Cu; 0.002 to 0.05 mass % of Ti; 0.001 to 0.05 mass % of Si; 0.001 to 0.01 mass % of B; and the balance being Sn.