SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM

摘要

A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.

主权项

1. A substrate cleaning apparatus comprising:
a rotary driving unit configured to rotate a substrate; a liquid nozzle positioned above the substrate and configured to eject a cleaning liquid to a surface of the substrate; a gas nozzle positioned above the substrate and configured to eject a dry gas to the surface of the substrate; an imaging unit positioned above the substrate and configured to image the surface of the substrate; and a control unit configured to control the rotary driving unit, the liquid nozzle, the gas nozzle, and the imaging unit; wherein the liquid nozzle, the gas nozzle, and the imaging unit are located such that the liquid nozzle, the gas nozzle, and the imaging unit are juxtaposed along the radial direction of the substrate from the peripheral side to the center thereof in this order as viewed from the top.