| 摘要 |
A method for producing an optoelectronic component (100) comprises steps for providing a support (200) having an upper side (201), for creating on the upper side (201) of the support (200) a region (220) that is recessed with respect to a mounting region (210) of the upper side (201), wherein a step (230) is formed between the mounting region (210) and the recessed region (220), for arranging on the upper side (201) of the support (200) a metallization (250) extending over the mounting region (210) and the recessed region (220), for creating a separating line (270) in the metallization (250), wherein the metallization (250) is completely cut through, at least in certain portions, in the mounting region (210) and is at least not completely cut through in the recessed region (220), and for arranging over the mounting region (210) of the upper side (201) an optoelectronic semiconductor chip (110), wherein the optoelectronic semiconductor chip (110) is aligned at the separating line (270). |
