发明名称 |
GRIPPING MECHANISM |
摘要 |
A gripping mechanism includes:
a plurality of chuck claws that, when having come close to each other, generate a gripping force on a gripped body;a chuck body that holds the plurality of chuck claws on a common planar surface, and moves them on the planar surface; anda plurality of chuck plates that, when each of the plurality of chuck claws grips the gripped body, are interposed between each of the plurality of chuck claws and the gripped body, whereina thermal expansion coefficient αl of the plurality of chuck claws, a thermal expansion coefficient α2 of the plurality of chuck plates and a thermal expansion coefficient αW of the gripped body has a relationship indicated by Equation 1:;αW<α1<α2 (Equation 1) |
申请公布号 |
US2017087642(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
US201615273726 |
申请日期 |
2016.09.23 |
申请人 |
Shin-Etsu Chemical Co., Ltd. |
发明人 |
KASHIWAGI Yusuke;OTOSAKA Tetsuya |
分类号 |
B23B31/163 |
主分类号 |
B23B31/163 |
代理机构 |
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代理人 |
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主权项 |
1. A gripping mechanism comprising:
a plurality of chuck claws that, when having come close to each other, generate a gripping force on a gripped body; a chuck body that holds the plurality of chuck claws on a common planar surface, and moves them on the planar surface; and a plurality of chuck plates that, when each of the plurality of chuck claws grips the gripped body, are interposed between each of the plurality of chuck claws and the gripped body, wherein a thermal expansion coefficient α1 of the plurality of chuck claws, a thermal expansion coefficient α2 of the plurality of chuck plates and a thermal expansion coefficient αW of the gripped body has a relationship indicated by Equation 1:
αW<α1<α2 (Equation 1) |
地址 |
Tokyo JP |