发明名称 ANTENNAS FOR PLATFORM LEVEL WIRELESS INTERCONNECTS
摘要 Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.
申请公布号 WO2017052660(A1) 申请公布日期 2017.03.30
申请号 WO2015US52496 申请日期 2015.09.25
申请人 INTEL CORPORATION 发明人 ELSHERBINI, Adel A.;KAMGAING, Telesphor;OSTER, Sasha N.;RAWLINGS, Brandon M.;DOGIAMIS, Georgios C.
分类号 H01Q1/22;H01Q9/04 主分类号 H01Q1/22
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