发明名称 THERMAL INTERFACE MATERIALS INCLUDING ELECTRICALLY-CODUCTIVE MATERIAL
摘要 According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
申请公布号 US2017094831(A1) 申请公布日期 2017.03.30
申请号 US201615271635 申请日期 2016.09.21
申请人 LAIRD TECHNOLOGIES, INC. 发明人 Khorrami Mohammadali;Dixon Paul Francis
分类号 H05K7/20;H05K1/02;H05K9/00;H01P1/201 主分类号 H05K7/20
代理机构 代理人
主权项 1. A thermal interface material comprising: a top surface; a bottom surface; one or more outer side surfaces extending between the top and bottom surfaces; and electrically-conductive material along and/or adjacent the one or more outer side surfaces; whereby the thermal interface material is configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow; and/or whereby the electrically-conductive material will be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
地址 Earth City MO US