发明名称 |
THERMAL INTERFACE MATERIALS INCLUDING ELECTRICALLY-CODUCTIVE MATERIAL |
摘要 |
According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure. |
申请公布号 |
US2017094831(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
US201615271635 |
申请日期 |
2016.09.21 |
申请人 |
LAIRD TECHNOLOGIES, INC. |
发明人 |
Khorrami Mohammadali;Dixon Paul Francis |
分类号 |
H05K7/20;H05K1/02;H05K9/00;H01P1/201 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A thermal interface material comprising:
a top surface; a bottom surface; one or more outer side surfaces extending between the top and bottom surfaces; and electrically-conductive material along and/or adjacent the one or more outer side surfaces; whereby the thermal interface material is configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow; and/or whereby the electrically-conductive material will be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure. |
地址 |
Earth City MO US |