| 摘要 |
A method includes: receiving an electrical signal from a temperature sensor, wherein the temperature sensor is disposed within a package including a processor chip, further wherein the temperature sensor is thermally separated from the processor chip by materials within the package, generating temperature information from the electrical signal, processing the temperature information to determine that a performance of the processor chip should be mitigate, and mitigating the performance of the processor chip in response to the temperature information, wherein processing the temperature information and mitigating the performance of the processor are performed by the processor chip. |
