ENHANCEMENT OF CHIP THERMAL PERFORMANCE THROUGH SILICON THERMAL CONDUCTIVITY MODULATION

摘要

An integrated circuit includes inter-digital transducers in a silicon die, where the inter-digital transducers are driven to excite phonons in the silicon die to modulate its thermal conductivity. The thermal conductivity may be increased by exciting acoustic phonons in the silicon die, so that heat dissipation is improved, or the thermal conductivity may be decreased by exciting optical phonons so that heat dissipation is reduced. In conjunction with power management, the thermal conductivity is increased or decreased depending upon the power states of various functional units in the silicon die and depending upon various temperature sensors.

主权项

1. A system comprising:
a silicon die having an active layer, the active layer comprising
a processor;a power rail to provide current to the processor;a temperature sensor to provide a signal indicative of a temperature of the processor; andat least one functional unit; at least one transducer; and a controller to drive the at least one transducer to excite acoustic phonons or optical phonons in the silicon die.