发明名称 HIGH-FREQUENCY CIRCUIT MODULE, AND LAMINATED HIGH-FREQUENCY CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency circuit module wherein its good high-frequency characteristic having scarcely parasitic capacitances is obtained by a simple configuration. SOLUTION: In the high-frequency circuit module, at least a plurality of signal lines 3 are formed on one surface of a dielectric substrate 1, a grounded conductor 2 is formed on the other surface of the dielectric substrate 1, and further, a high-frequency component is mounted between the first and second signal lines of the plurality of signal lines 3. Hereupon, a metal conductor 7 connected with the grounded conductor 2 is disposed constitutionally in a gap 6 which is present under the high-frequency component and is interposed between the first and second signal lines. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007027518(A) 申请公布日期 2007.02.01
申请号 JP20050209266 申请日期 2005.07.19
申请人 RICOH CO LTD 发明人 ADACHI KAZUHIKO
分类号 H01L23/12 主分类号 H01L23/12
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