METHOD AND ARRANGEMENT FOR PROVIDING ELECTRICAL CONNECTION TO IN-MOLD ELECTRONICS

摘要

A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

主权项

1. A multilayer structure (100), comprising
a preferably flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a preferably flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film accommodating at least part of one or more of the conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with an external element (118), such as a wire or connector, via the associated gap.