ELECTRONIC COMPONENT

摘要

An element body includes a first principal surface and a second principal surface opposing each other in a first direction. A first terminal electrode is disposed on the first principal surface side of the element body. A second terminal electrode is disposed on the second principal surface side of the element body. The first terminal electrode includes a first sintered metal layer formed on the first principal surface; and a first plating layer formed on the first sintered metal layer and including base metal. The second terminal electrode includes a second sintered metal layer formed on the second principal surface, a second plating layer formed on the second sintered metal layer and including base metal, and a solder layer formed on the second plating layer and including Sn and a metal having a higher melting point than the melting point of Sn.

主权项

1. An electronic component comprising:
an element body having a first principal surface and a second principal surface opposing each other in a first direction; a first terminal electrode disposed on the first principal surface side of the element body; and a second terminal electrode disposed on the second principal surface side of the element body, wherein the first terminal electrode includes: a first sintered metal layer formed on the first principal surface; and a first plating layer formed on the first sintered metal layer and including base metal, and the second terminal electrode includes: a second sintered metal layer formed on the second principal surface; a second plating layer formed on the second sintered metal layer and including base metal; and a solder layer formed on the second plating layer and including Sn and a metal having a higher melting point than the melting point of Sn.