METHOD FOR MANUFACTURING A CIRCUIT HAVING A LAMINATION LAYER USING LASER DIRECT STRUCTURING PROCESS

摘要

The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

主权项

1. Circuit using the method for manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) process, comprising:
Various Multiple-layer circuit formed repeated processes of patter formation of each layer circuit by laser irradiation, plating of each layer circuit and paint coating using LDS on paint coated LDS substrate injection-molding substrate or others using LDS material; Pad including top upper part of multilayer circuits for combination of electronic device; LDS part formed through masking area during paint coating, or LDS part formed through paint delamination area from previous layer before paint coating.