发明名称 |
DOUBLE-SIDED HEAT EXCHANGER FOR FLUID-COOLED ELECTRONICS WITH A FLAT COPLANAR SERIES-WISE COOLANT FLOW PATH |
摘要 |
A fluid-cooled electronics assembly for high-power electronics includes an arrangement of electronic components that defines an upper-side of the arrangement and a lower-side of the arrangement opposite the upper-side. An upper-chamber is thermally coupled to the upper-side, and a lower-chamber thermally coupled to the lower-side. The upper-chamber and the lower-chamber are further configured to direct flowing-coolant series-wise from the lower-chamber into the upper-chamber. The upper-chamber and the lower-chamber are further configured to cooperatively define a manifold-connection operable to couple the assembly to a manifold-outlet and a manifold-inlet of a coolant-manifold. The assembly also includes a fitting configured to define an inlet-port of the assembly that directs the flowing-coolant from the manifold-outlet to the lower-inlet, and an outlet-port that directs the flowing-coolant from the upper-outlet to the manifold-inlet. The inlet-port and the outlet-port are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section. |
申请公布号 |
US2017094836(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
US201615228008 |
申请日期 |
2016.08.04 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
Lo Brian;Ebenhart Mark A. |
分类号 |
H05K7/20;H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A fluid-cooled electronics assembly for high-power electronics, said assembly comprising:
an arrangement of electronic components that defines an upper-side of the arrangement and a lower-side of the arrangement opposite the upper-side; an upper-chamber thermally coupled to the upper-side, said upper-chamber configured to guide flowing-coolant from an upper-inlet to an upper-outlet to remove heat from the upper-side; a lower-chamber thermally coupled to the lower-side, said lower-chamber configured to guide flowing-coolant from a lower-inlet to a lower-outlet to remove heat from the lower-side, wherein the upper-chamber and the lower-chamber are further configured to cooperatively define a transfer-path that fluidicly couples the lower-outlet to the upper-inlet such that the flowing-coolant flows series-wise from the lower-chamber into the upper-chamber, wherein the upper-chamber and the lower-chamber are further configured to cooperatively define a manifold-connection operable to couple the assembly to a manifold-outlet and a manifold-inlet of a coolant-manifold such that the flowing-coolant flows through the assembly; and a fitting configured to define an inlet-port of the assembly that directs the flowing-coolant from the manifold-outlet to the lower-inlet, and an outlet-port that directs the flowing-coolant from the upper-outlet to the manifold-inlet, wherein the inlet-port and the outlet-port are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section. |
地址 |
TROY MI US |