发明名称 |
ADHESIVE FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
摘要 |
The present invention relates to an adhesive film which has a thixopropic index of 1.5 to 7.5 at 110°C and is used for fixating a first semiconductor element and a second semiconductor element, the first semiconductor element having an area the ratio of which to an area of the second semiconductor element is 0.65 or lower, and to a method for producing a semiconductor device using the adhesive film and to a semiconductor device using the adhesive film. |
申请公布号 |
WO2017052289(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2016KR10692 |
申请日期 |
2016.09.23 |
申请人 |
LG CHEM, LTD |
发明人 |
KIM, Jung Hak;KIM, Hee Jung;KIM, Se Ra;LEE, Kwang Joo;KIM, Young Kook;NAM, Seung Hee |
分类号 |
H01L23/00;C09J7/00;H01L23/482;H01L23/532;H01L25/065;H01L25/07 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|