发明名称 |
THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES |
摘要 |
Disclosed herein are systems and methods for thermal management of a flexible integrated circuit (IC) package. In some embodiments, a flexible IC package may include a flexible substrate material; a component disposed in the flexible substrate material; a channel disposed in the flexible substrate material forming a closed circuit and having a portion proximate to the component; electrodes disposed in the flexible substrate material and positioned at locations proximate to the channel, wherein the electrodes are coupled to an electrode controller to selectively cause one or more of the electrodes to generate an electric field; and an electrolytic fluid disposed in the channel. In some embodiments, a flexible IC package may be coupled to a wearable support structure. Other embodiments may be disclosed and/or claimed. |
申请公布号 |
WO2017052894(A1) |
申请公布日期 |
2017.03.30 |
申请号 |
WO2016US48163 |
申请日期 |
2016.08.23 |
申请人 |
INTEL CORPORATION |
发明人 |
KUMAR, Siddarth;DHAVALESWARAPU, Hemanth K. |
分类号 |
H01L23/498;H01L23/495;H01L23/538 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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