| 摘要 |
A chipset (8) and an electronic device (100) comprising the chipset (8). The chipset (8) comprises: a first chip (81), which comprises an insulating substrate (811) and a first integrated circuit (813) provided on the insulating substrate (811); and a second chip (83), which comprises a semiconductor substrate (831) and a second integrated circuit (833) provided on the semiconductor substrate (831). The chipset (8) is inexpensive; correspondingly, the electronic device (100) comprising the chipset (8) also is inexpensive. |
