发明名称 |
MODULAR ELECTRONICS CHASSIS |
摘要 |
An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis includes a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure. |
申请公布号 |
EP3020259(A4) |
申请公布日期 |
2017.03.29 |
申请号 |
EP20140823501 |
申请日期 |
2014.07.08 |
申请人 |
Exablox Corporation |
发明人 |
PRIVITERA, Peter;CARVER, Jon;DRUKER, Joshua;HUNT, Tad;BROCKETT, Douglas;BALAN, Ramesh |
分类号 |
H05K5/02;G06F1/16;G06F1/18;G11B33/02;G11B33/12 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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