Camera module

摘要

A camera module is provided which has a simple structure, can be easily assembled, can avoid the adverse effects of dust on imaging, and can promote heat dissipation of an imaging device. In a camera module, which includes a lens unit that has a cylindrical thread portion, a flat plate-shaped imaging device that is mounted on a printed wiring board, and a holder that holds the lens unit and the printed wiring board with maintaining the predetermined positional relationship therebetween, an imaging field of the imaging device is disposed in a space tightly closed by a first spacer that is made into a ring shape made of an elastic material the surface of which is an adhesive surface, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer. The first spacer may be made of a material that further has favorable thermal conductivity.

主权项

1. A camera module comprising:
a lens unit that has a cylindrical thread portion and an optical axis; a flat plate-shaped imaging device that is mounted on a printed wiring board; a holder that has a cylindrical opening that opens along the optical axis of the lens unit and engages with the thread portion, and holds the lens unit and the printed wiring board while maintaining a predetermined positional relationship between the lens unit and the printed wiring board; and a first spacer that is formed into a ring shape made of an elastic material the surface of which is an adhesive surface, and has a first surface situated on a side of the opening and a second surface situated on a side of the imaging device, the first and second surfaces being parallel with a plane orthogonal to the optical axis of the lens unit and at least one of the first and second surfaces being made into a slidable surface by impairing adhesion properties of the adhesive surface, wherein the imaging device has an imaging field thereof that is disposed in a space tightly closed by the first spacer between the holder and the printed wiring board, and the adhesive surface is exposed at least in an inner peripheral wall of the first spacer.