发明名称 |
Insulator module having structure enclosing atomspheric pressure gas |
摘要 |
A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air. |
申请公布号 |
US9606587(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201213662030 |
申请日期 |
2012.10.26 |
申请人 |
Google Inc. |
发明人 |
Hamburgen William |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
Brake Hughes Bellermann LLP |
代理人 |
Brake Hughes Bellermann LLP |
主权项 |
1. A device comprising:
a heat-absorbing component; one or more heat-generating components, at least one heat-generating component located in proximity to an inner surface of the heat-absorbing component, wherein a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component, the gap having a length of less than one millimeter; and an insulator, located in the gap, including a container, the container being separate from a frame of the device, the container being a flexible polymer-based pouch structure defining an internal cavity, the flexible polymer-based pouch structure including at least one layer of material coupled with itself or another layer with a sealant, the container enclosing atmospheric pressure gas within the internal cavity, the atmospheric pressure gas having a thermal conductivity lower than air, wherein a thickness of the insulator is less than one millimeter. |
地址 |
Mountain View CA US |