发明名称 Controlled fluid delivery in a microelectronic package
摘要 A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.
申请公布号 US9604210(B2) 申请公布日期 2017.03.28
申请号 US201514683826 申请日期 2015.04.10
申请人 Intel Corporation 发明人 Supriya Lakshmi;Matayabas, Jr. James C.;Chakrapani Nirupama
分类号 B01L3/00;B05D3/12;B05D5/00;B29C65/00;B01J19/00 主分类号 B01L3/00
代理机构 Jordan IP Law, LLC 代理人 Jordan IP Law, LLC
主权项 1. A method for forming virtual fluidic channels on a substrate to channel a fluid to a die, comprising: providing a die on a substrate, the die including one or more fluidic circuits; patterning a coating on the substrate to define a fluid path from an edge of the substrate to the die: patterning a coating on a cover corresponding to the fluid flow path; positioning a spacer on the substrate; and placing the cover over the substrate and the spacer, wherein the coatings define a virtual fluidic path to channel a fluid to the die.
地址 Santa Clara CA US