HYBRID THERMAL SOLUTION FOR ELECTRONIC DEVICES

摘要

Various techniques for removing heat from electronic devices are disclosed herein. In one embodiment, an electronic device includes a processor having a first surface area and a heat spreader in direct contact with the processor. The heat spreader has a second surface area greater than the first surface area of the processor. The electronic device also includes a housing panel spaced apart from the heat spreader by a gap. The housing panel has an air inlet proximate a first end of the gap and an air outlet proximate a second end of the gap. The electronic device further includes an air mover configured to move cooling air through the gap from the air inlet toward the air outlet of the housing panel.

主权项

1. An electronic device, comprising:
a heat source; a heat spreader having a first surface and a second surface in contact with the heat source, the first surface having a surface area greater than that of the heat source, wherein the heat spreader is configured to remove heat from the heat source via the first surface and distribute the removed heat to the second surface of the heat spreader; a housing panel spaced apart from the first surface of the heat spreader by a gap; and an air mover proximate the heat spreader, the air mover being positioned to force cooling air through the gap between the housing panel and the first surface of the heat spreader in a direction generally tangential to the first surface of the heat spreader.