| 摘要 |
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the rate of polishing silicon nitride is low. The polishing composition comprises abrasive grains, a quaternary ammonium salt having a benzene ring in the structure, and a water-soluble polymer and/or a surfactant. This polishing composition is for use in polishing a work which includes polysilicon and/or amorphous silicon and further includes silicon nitride. |
