| 摘要 |
PURPOSE:To obtain a high-quality semiconductor integrated circuit device, in which there is no deformation of leads at the characteristics test or no such occurrence as attachment of foreign materials to the leads, by connecting an IC package to outer leads and by drilling insertion holes to enable to insert contacts for measuring electric characteristics. CONSTITUTION:In case of a semiconductor integrated circuit device, which has the approximately same number of respective pins, pitch, and package mills, regardless of the shape of outer leads 2, 12, and 22, IC packages 1, 11, and 21 are connected to outer leads 2, 12, and 22, respectively. In addition, insertion holes are drilled in the same matrix to enable to insert contacts for measuring electric characteristics. Therefore, at the test for electric characteristics, the contacts are inserted into insertion holes 4, and are contacted with the outer leads 2, 12, and 22, and then, these contacts are contacted with the respective outer portion of the IC packages 1, 11, and 21 of the outer leads 2, 12, and 22. As a result, the measurement of electric characteristics is made possible without deformation of the leads or attachment of foreign materials to the leads. |
