发明名称 CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES USING ESTIMATED SKIN TEMPERATURE
摘要 A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.
申请公布号 US2017083064(A1) 申请公布日期 2017.03.23
申请号 US201514860203 申请日期 2015.09.21
申请人 QUALCOMM Incorporated 发明人 Mittal Arpit;Saeidi Mehdi;Mahmoudi Farsheed
分类号 G06F1/20;G05B15/02 主分类号 G06F1/20
代理机构 代理人
主权项 1. A method for mitigating temperature of a device, the method comprising: receiving a signal from a temperature sensor, wherein the temperature sensor is disposed within the device having a processor chip that produces heat within the device, generating temperature data from the signal; processing the temperature data to generate data indicative of a temperature of an external surface of the device, wherein processing the temperature data includes applying a low pass filter, an amplitude attenuation, and a delay to the temperature data; and reducing an operating parameter of the processor chip in response to the data indicative of the temperature of the external surface of the device.
地址 San Diego CA US