| 发明名称 |
Array Substrate and Manufacturing Method Thereof, and Display Apparatus Thereof |
| 摘要 |
An embodiment of the present disclosure provides an array substrate and a manufacturing method thereof and a display apparatus. The array substrate includes a base substrate, wherein, the base substrate is provided with a bonding region; a bonding pad and a first bonding lead connected with the bonding pad and extending to an edge of the base substrate are provided in the bonding region, and one or more metal patterns are arranged above the first bonding lead, the one or more metal patterns crossing over the first bonding lead and being insulated from the first bonding lead. |
| 申请公布号 |
US2017084640(A1) |
申请公布日期 |
2017.03.23 |
| 申请号 |
US201615189645 |
申请日期 |
2016.06.22 |
| 申请人 |
BOE Technology Group Co., Ltd. ;Hefei Xinsheng Optoelectronics Technology Co., Ltd. |
发明人 |
Gao Jilei;Jiang Xuebing;Zhao Jian |
| 分类号 |
H01L27/12;H01L23/00;G02F1/1362;G02F1/1345 |
主分类号 |
H01L27/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An array substrate, comprising a base substrate, wherein, the base substrate is provided with a bonding region; a bonding pad and a first bonding lead connected with the bonding pad and extending to an edge of the base substrate are provided in the bonding region, and one or more metal patterns are arranged above the first bonding lead, the one or more metal patterns crossing over the first bonding lead and being insulated from the first bonding lead. |
| 地址 |
Beijing CN |
