PLATFORM WITH THERMALLY STABLE WIRELESS INTERCONNECTS

摘要

Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

主权项

1. A packaged device comprising:
an integrated circuit chip; a package substrate to carry the integrated circuit chip, the package substrate having conductive lines to communicatively couple the integrated circuit chip to one or more external components; and a radio frequency integrated circuit (RFIC) module communicatively coupled to the integrated circuit chip by traces for transmitting baseband signals, wherein the RFIC module comprises:
a radio frequency integrated circuit (RFIC) coupled to the RFIC module; anda millimeter wave antenna communicatively coupled to the RFIC to send data to an external device.