发明名称 ANTENNA-INTEGRATED COMMUNICATION MODULE AND METHOD FOR MANUFACTURING SAME
摘要 According to the present invention, a multilayer substrate comprises a first dielectric layer and a conductor pattern that is arranged within and on the upper surface of the first dielectric layer; a second dielectric layer, which is formed of a material different from that of the first dielectric layer, is arranged on the multilayer substrate; the second dielectric layer is provided with at least one radiation element; a feeder line connects the radiation element and the conductor pattern with each other; the feeder line comprises an electrically conductive conductor pin that extends in the thickness direction of the second dielectric layer; and the conductor pin electrically connects the radiation element and the conductor pattern arranged on the upper surface of the first dielectric layer with each other. Consequently, the present invention provides an antenna-integrated communication module which is easy to enhance the accuracy in circuit simulation, while having a structure that has a high degree of freedom in selection of dielectric materials.
申请公布号 WO2017047396(A1) 申请公布日期 2017.03.23
申请号 WO2016JP75695 申请日期 2016.09.01
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MIZUNUMA, Ryuken;BANBA, Shinichiro;YOKOYAMA, Michiharu;UEDA, Hideki;YAMADA, Hideaki;MORIOKA, Noboru
分类号 H01L25/00;H01L23/12;H01Q1/38;H01Q3/26;H01Q23/00 主分类号 H01L25/00
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