WIRING BOARD HAVING ISOLATOR AND BRIDGING ELEMENT AND METHOD OF MAKING WIRING BOARD

摘要

A wiring board includes a low CTE (coefficient of thermal expansion) and high thermal conductivity isolator incorporated in a resin laminate by an adhesive and a bridging element disposed over the isolator and the resin laminate and electrically coupled to a first routing circuitry on the isolator and a second routing circuitry on the resin laminate. The isolator provides CTE-compensated contact interface for a semiconductor chip to be assembled thereon, and also provides primary heat conduction for the chip. The bridging element offers a reliable connecting channel for interconnecting contact pads on the isolator to terminal pads on the resin laminate.

主权项

1. A wiring board having an isolator and a bridging element, comprising:
a resin laminate having a planar top surface, a planar bottom surface and an aperture, wherein the aperture has interior sidewalls extending through the resin laminate between the top surface and the bottom surface thereof; an isolator having a planar top surface and a planar bottom surface and disposed in the aperture of the resin laminate, wherein peripheral edges of the isolator are attached to the interior sidewalls of the resin laminate by an adhesive; a first routing circuitry disposed on the top surface of the isolator and a second routing circuitry disposed on the top surface of the resin laminate, wherein the first routing circuitry and the second routing circuitry are spaced apart from each other; and a bridging element that is disposed over the isolator and the resin laminate and electrically connects the first routing circuitry and the second routing circuitry.