MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME

摘要

A MEMS sensor package comprises a MEMS die that includes a substrate having a sensor formed thereon and a cap layer coupled to the substrate. The cap layer has a cavity overlying a substrate region at which the sensor resides. A port extends between the cavity and a side wall of the MEMS die and enables admittance of fluid into the cavity. Fabrication methodology entails providing a substrate structure having sensors formed thereon, providing a cap layer structure having inwardly extending cavities, and forming a channel between pairs of the cavities. The cap layer structure is coupled with the substrate structure and each channel is interposed between a pair of cavities. A singulation process produces a pair of sensor packages, each having a port formed by splitting the channel, where the port is exposed during singulation and extends between its respective cavity and side wall of the sensor package.

主权项

1. A microelectromechanical systems (MEMS) sensor package comprising:
a MEMS die, said MEMS die comprising:
a substrate having a first inner surface and a first outer surface;a MEMS sensor formed on said first inner surface; anda cap layer having a second inner surface and a second outer surface, wherein said second inner surface of said cap layer is coupled to said first inner surface of said substrate, said cap layer includes a cavity extending inwardly from said second inner surface and overlying a region of said first inner surface of said substrate, said MEMS sensor resides in said cavity at said region of said first inner surface of said substrate, and a port extends between said cavity and a side wall of said MEMS die, said side wall extending between said first outer surface of said substrate and said second outer surface of said cap layer; and an encapsulant covering said MEMS die, wherein said encapsulant is absent from said side wall and said encapsulant does not obstruct said port.