METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES

摘要

Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.

主权项

1. An apparatus, comprising:
a low pressure chamber defining an interior configured for placement of an electronic device in the interior and removal of the electronic device from the interior; an evacuation pump connected to the low pressure chamber and configured to decrease pressure within the low pressure chamber; a heater adapted to heat a surface of the electronic device, placed in the low pressure chamber, through contact with the surface of the electronic device.