TARGET MATERIAL SPUTTERING DEVICE AND METHOD FOR SPUTTERING TARGET MATERIAL USING SAME

摘要

A target material sputtering device comprises: a back plate (11) and a plurality of electromagnetic coil units (12) insulated from each other and evenly distributed below the back plate (11). In a preset period, the plurality of electromagnetic coil units (12) generates a magnetic field (14) which moves relative to the back plate (11). The magnetic field (14) is orthogonal to the back plate (11). Also disclosed is a method for sputtering a target material (13) using the target material sputtering device.