| 摘要 |
A hydrosilylation curable composition contains a combination of high and low viscosity polyorganosiloxanes, a silicone resin, a crosslinker, and a catalyst. The composition, and the cured product thereof, is useful in optical devices such as charged coupled devices (CCDs), light emitting diodes (LEDs), lightguides, optical cameras, photo-couplers, and waveguides. Processes for fabricating the optical devices include various molding techniques, including overmolding. |
