| 摘要 |
PROBLEM TO BE SOLVED: To highly accurately inspect an abnormality in each layer inside a transmissive workpiece having a laminate structure, with a simplified configuration.SOLUTION: A transmissive wafer W having a laminate structure is placed at a first imaging position on a lattice-shaped holding table and is held in an adsorbed manner. After the bend of the wafer is corrected to be flat, first imaging of the wafer is performed. Thereafter, the wafer is moved so that portions of the wafer W having been in contact with the holding table are moved to be above radiation windows in the lattice. The wafer is then held in an adsorbed manner, and second imaging is performed. An image in the shape of the wafer is formed by combining image data obtained through the first imaging and the second imaging, and an image of a predetermined layer is reconfigured. A matching process is performed in the image and a predetermined reference image to determine whether or not there is a foreign material or contamination in the predetermined layer inside the wafer. |
