发明名称 樹脂剥がし方法及び樹脂剥がし装置
摘要 PROBLEM TO BE SOLVED: To peel resin surely from the entire surface of a planar work, without causing cracking of the planar work.SOLUTION: A resin peeling method includes a step for repeating, at a plurality of clamp positions, an operation of peeling a resin (85) on the outer periphery of a planar work (W) by clamping the resin (85) protruding from the outer periphery of the planar work (W) with a clamp (5), specifying the travel of a holding table (3) for holding the planar work (W) within the radius thereof, and then raising the clamp (5) in accordance with horizontal movement of the holding table (3), and a step for performing operation of peeling the resin (85) from the entire planar work (W) by clamping the end (82) of the resin (85) with the clamp (5) at the remaining clamp position, specifying the travel of the holding table (3) for holding the planar work (W) larger than the radius thereof, and then raising the clamp (5) in accordance with the horizontal movement of the holding table (3).
申请公布号 JP6099343(B2) 申请公布日期 2017.03.22
申请号 JP20120208164 申请日期 2012.09.21
申请人 株式会社ディスコ 发明人 現王園 二郎
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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