| 摘要 |
An heat dissipation device for an optical module, includes a guide rail, herein the guide rail is set on a circuit board for accommodating an optical module, the guide rail is covered with a heat conduction block, heat dissipation teeth are formed in a part of areas on the heat conduction block, the heat dissipation teeth are positioned at a rear portion of the guide rails, the heat dissipation teeth extend in a direction close to the circuit board so that the heat dissipation teeth and the guide rails are positioned at the same side of the heat conduction block. Compared with a structure in which the heat dissipation teeth and the guide rail are positioned at both sides of the heat conduction block, the present invention reduces a height of an assembly of the optical module and effectively solves the problem of the configured height restriction of the assembly of the optical module, it is favorable to the miniaturization of a system, and the present invention further ensures the heat dissipation efficiency of the heat dissipation device through the thermal conduction of the heat conduction block and the heat dissipation of the heat dissipation teeth. |
