Photosintering of micron-sized copper particles

摘要

Micron-sized metal particles in an ink or paste composition are deposited onto a substrate and then photosimered. The substrate may comprise a polymeric material. The polymeric substrate may have a coefficient of thermal expansion greater than two times the coefficient of thermal expansion of the photosimered ink or paste composition.

主权项

1. A method for making a conductive film comprising:
depositing an ink or paste composition comprising micron-sized metal particles onto a polymeric substrate having a melting point less than 200° C., wherein the micron-sized metal particles in the ink or paste composition have an average particle size greater than one micron; and photosintering the ink or paste composition after being deposited onto the substrate, wherein during the photosintering of the ink or paste composition, some heat generated in the micron-sized metal particles as a result of the photosintering is transferred from the particles into the substrate to reduce ramping up of the heat within the particles, which also results in a partial melting of a surface of the substrate so that some of the particles physically embed into the substrate surface.