| 发明名称 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | ||
| 摘要 | A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. | ||
| 申请公布号 | US9601475(B2) | 申请公布日期 | 2017.03.21 |
| 申请号 | US201615041127 | 申请日期 | 2016.02.11 |
| 申请人 | Intel Deutschland GmbH | 发明人 | Brunnbauer Markus;Meyer Thorsten;Bradl Stephan;Plieninger Ralf;Pohl Jens;Pressel Klaus;Sezi Recai |
| 分类号 | H01L21/301;H01L25/00;H01L21/56;H01L23/31;H01L23/538;H01L23/552;H01L23/60;H01L23/00;H01L23/48;H01L21/48 | 主分类号 | H01L21/301 |
| 代理机构 | Eschweiler & Potashnik, LLC | 代理人 | Eschweiler & Potashnik, LLC |
| 主权项 | 1. A method, comprising: providing a plurality of semiconductor chips each having a first main surface and a second main surface; placing the first main surface of the plurality of semiconductor chips on a surface of a carrier sheet; applying an electrically conducting layer to at least one region of the second main surface; applying a molding compound to at least one region of the electrically conducting layer; removing the carrier sheet; and exposing the first main surface, wherein at least one region of the electrically conducting layer forms a coplanar surface with the first main surface of the plurality of semiconductor chips. | ||
| 地址 | Neubiberg DE | ||