发明名称 |
Unit of piezoelectric element |
摘要 |
In object to provide a unit of piezoelectric element having a preferable bending strength and preferably used as a part of a driving unit, a unit of piezoelectric element comprising: a multilayer piezoelectric element, having internal electrodes laminated having a piezoelectric body layer in-between and a pair of external electrodes formed on side surfaces extending along laminating direction and electrically connected to the internal electrodes, a wiring part connected to the external electrodes via a solder part, wherein a solder is solidified, a resin part, joining one end surface in the laminating direction of the multilayer piezoelectric element and a mounting surface of a connection member placed to face the one end surface, wherein the resin part is continuous from the one end surface and the mounting surface to the solder part; and the resin part covers the solder part, is provided. |
申请公布号 |
US9601683(B2) |
申请公布日期 |
2017.03.21 |
申请号 |
US201314015315 |
申请日期 |
2013.08.30 |
申请人 |
TDK CORPORATION |
发明人 |
Ozawa Satoshi;Ono Shuto;Abe Akio;Shimazaki Kohsuke |
分类号 |
H01L41/047;H01L41/053;G02B7/08;H01L41/083;H02N2/02 |
主分类号 |
H01L41/047 |
代理机构 |
Arent Fox LLP |
代理人 |
Arent Fox LLP |
主权项 |
1. A unit of piezoelectric element comprising:
a multilayer piezoelectric element, having internal electrodes laminated having a piezoelectric body layer in-between and a pair of external electrodes formed on the entire side surfaces extending along laminating direction and electrically connected to the internal electrodes, a wiring part connected to the plurality of external electrodes via a solder part, wherein a solder is solidified, a first resin part interposed between one end surface in the laminating direction of the multilayer piezoelectric element and a mounting surface of a connection member placed to face the one end surface to join the one end surface and the mounting surface, wherein: the first resin part is continuous from one of the external electrodes to the other external electrode; and the first resin part integrally covers the solder part formed on each of the external electrodes. |
地址 |
Tokyo JP |