发明名称 |
Integrated circuit device system with elevated configuration and method of manufacture thereof |
摘要 |
A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device. |
申请公布号 |
US9603252(B1) |
申请公布日期 |
2017.03.21 |
申请号 |
US201314077908 |
申请日期 |
2013.11.12 |
申请人 |
SMART Modular Technologies, Inc. |
发明人 |
Iyer Satyanarayan Shivkumar;Chang Reuben J.;Mahran Victor |
分类号 |
H05K1/11;H05K1/14;H05K1/18;H05K3/30 |
主分类号 |
H05K1/11 |
代理机构 |
Wong & Rees LLP |
代理人 |
Wong & Rees LLP |
主权项 |
1. A method of manufacture of an integrated circuit device system comprising:
providing a carrier having a first side; mounting a base device on the first side; mounting a first riser, adjacent to the base device, and a second riser, adjacent to a side of the base device opposite the first riser, on the first side; mounting a peripheral elevated device on the first riser, the peripheral elevated device having a device overhang above the base device; and mounting an inner elevated device on the second riser, the inner elevated device having the device overhang above the base device. |
地址 |
Newark CA US |