发明名称 Integrated circuit device system with elevated configuration and method of manufacture thereof
摘要 A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a first riser mounted on the first side; a second riser mounted on the first side and adjacent to the first riser; a peripheral elevated device mounted on the first riser, the peripheral elevated device having a device overhang above the base device; and an inner elevated device mounted on the second riser, the inner elevated device having the device overhang above the base device.
申请公布号 US9603252(B1) 申请公布日期 2017.03.21
申请号 US201314077908 申请日期 2013.11.12
申请人 SMART Modular Technologies, Inc. 发明人 Iyer Satyanarayan Shivkumar;Chang Reuben J.;Mahran Victor
分类号 H05K1/11;H05K1/14;H05K1/18;H05K3/30 主分类号 H05K1/11
代理机构 Wong & Rees LLP 代理人 Wong & Rees LLP
主权项 1. A method of manufacture of an integrated circuit device system comprising: providing a carrier having a first side; mounting a base device on the first side; mounting a first riser, adjacent to the base device, and a second riser, adjacent to a side of the base device opposite the first riser, on the first side; mounting a peripheral elevated device on the first riser, the peripheral elevated device having a device overhang above the base device; and mounting an inner elevated device on the second riser, the inner elevated device having the device overhang above the base device.
地址 Newark CA US