Methods and apparatus for treating exhaust gas in a processing system

摘要

Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas.

主权项

1. An apparatus for treating an exhaust gas in an exhaust conduit of a substrate processing system, comprising:
a plasma source coupled to an exhaust conduit of a process chamber; a reagent source coupled to the exhaust conduit upstream of the plasma source; a first control valve disposed between the reagent source and the exhaust conduit; a gas injection kit coupled to the exhaust conduit to controllably deliver a gas to the exhaust conduit, wherein the gas injection kit includes:
a pressure regulator to set a gas delivery pressure setpoint;a flow control device to provide a known flow of the gas at the pressure setpoint of the pressure regulator;a first pressure gauge disposed between the pressure regulator and the flow control device to monitor a delivery pressure of the gas; anda second control valve to selectively turn on and off the flow of the gas to the exhaust conduit; and a controller coupled to a signal from the first pressure gauge to provide a feedback loop to control the pressure of the gas delivered by the gas injection kit, wherein the controller is configured to turn the second control valve on or off in response to the first control valve being turned on or off.