发明名称 Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies
摘要 Example methods, apparatus, and products for creating an environmentally protective coating for integrated circuit assemblies are described herein. A preform plastic sheet is places over components of an integrated circuit such that during a reflow process, the preform plastic sheet melts to form a conformal coating over components of the integrated circuit assembly.
申请公布号 US9601451(B2) 申请公布日期 2017.03.21
申请号 US201514823021 申请日期 2015.08.11
申请人 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. 发明人 Kuczynski Joseph;Miller Melissa K.;Williams Heidi D.;Zhang Jing
分类号 H01L23/48;H01L23/00;B23K1/00;H05K3/34;H01L23/498;H01L23/31 主分类号 H01L23/48
代理机构 Kennedy Lenart Spraggins LLP 代理人 Kennedy Brandon C.;Robinson Douglas W.;Kennedy Lenart Spraggins LLP
主权项 1. An integrated circuit assembly comprising: an integrated circuit having a plurality of contact pads formed therein; a first preform sheet having holes formed therein corresponding to the location of the plurality of contact pads, the first preform being applied to a substrate side of the integrated circuit and configured to create a conformal coating during a reflow operation; a printed circuit board; a plurality of solder balls placed over the plurality of contact pads, the solder balls forming a connection between the integrated circuit and the printed circuit board during the reflow operation, wherein the first preform sheet melts during the reflow operation to form the conformal coating; and a second preform sheet being applied over the printed circuit board.
地址 Singapore SG