发明名称 |
Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies |
摘要 |
Example methods, apparatus, and products for creating an environmentally protective coating for integrated circuit assemblies are described herein. A preform plastic sheet is places over components of an integrated circuit such that during a reflow process, the preform plastic sheet melts to form a conformal coating over components of the integrated circuit assembly. |
申请公布号 |
US9601451(B2) |
申请公布日期 |
2017.03.21 |
申请号 |
US201514823021 |
申请日期 |
2015.08.11 |
申请人 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
发明人 |
Kuczynski Joseph;Miller Melissa K.;Williams Heidi D.;Zhang Jing |
分类号 |
H01L23/48;H01L23/00;B23K1/00;H05K3/34;H01L23/498;H01L23/31 |
主分类号 |
H01L23/48 |
代理机构 |
Kennedy Lenart Spraggins LLP |
代理人 |
Kennedy Brandon C.;Robinson Douglas W.;Kennedy Lenart Spraggins LLP |
主权项 |
1. An integrated circuit assembly comprising:
an integrated circuit having a plurality of contact pads formed therein; a first preform sheet having holes formed therein corresponding to the location of the plurality of contact pads, the first preform being applied to a substrate side of the integrated circuit and configured to create a conformal coating during a reflow operation; a printed circuit board; a plurality of solder balls placed over the plurality of contact pads, the solder balls forming a connection between the integrated circuit and the printed circuit board during the reflow operation, wherein the first preform sheet melts during the reflow operation to form the conformal coating; and a second preform sheet being applied over the printed circuit board. |
地址 |
Singapore SG |