发明名称 SEMICONDUCTOR MEMORY DEVICE
摘要 A semiconductor memory device according to an embodiment includes: an insulating layer; a conductive layer stacked above the insulating layer in a first direction, the conductive layer having a second direction as a longitudinal direction and a third direction as a short direction; and a channel semiconductor layer extending in the first direction, and the conductive layer including a recessed portion narrowed in the third direction.
申请公布号 US2017077119(A1) 申请公布日期 2017.03.16
申请号 US201514960888 申请日期 2015.12.07
申请人 Kabushiki Kaisha Toshiba 发明人 SAWABE Ryosuke;KITO Masaru
分类号 H01L27/115;H01L23/535 主分类号 H01L27/115
代理机构 代理人
主权项 1. A semiconductor memory device comprising: an insulating layer; a conductive layer stacked above the insulating layer in a first direction, the conductive layer having a second direction as a longitudinal direction and a third direction as a short direction; and a channel semiconductor layer extending in the first direction, and the conductive layer including a recessed portion narrowed in the third direction.
地址 Minato-ku JP