| 发明名称 |
SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor storage device of the present embodiments includes a substrate, a first semiconductor chip and a sealer. The substrate has wirings. The first semiconductor chip is connected to the wirings on the substrate. The sealer has a first surface, which does not face a top surface of the first semiconductor chip and is provided with a mark, and seals the first semiconductor chip. |
| 申请公布号 |
US2017077065(A1) |
申请公布日期 |
2017.03.16 |
| 申请号 |
US201615062368 |
申请日期 |
2016.03.07 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
SUGIMURA Misa;IIDA Akihiro |
| 分类号 |
H01L25/065;H01L21/56;H01L25/00;H01L23/544;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor storage device comprising:
a substrate comprising wiring; a first semiconductor chip that is connected to the wiring on the substrate; and a sealer that comprises a first surface, which does not face a top surface of the first semiconductor chip and is provided with a mark, and seals the first semiconductor chip. |
| 地址 |
Minato-ku JP |
